Cooling Technology: TEC/Peltier semiconductor cooling
Cooling Plate: For direct cooling on the back of the phone
Cooling Fan: Expels heat from the hot heatsink
Heatsink: Absorbs and disperses heat from the hot side of the TEC
Temperature: Advertisements may claim very low temperatures; actual temperature depends on the environment and phone's temperature
Power: USB powered
Battery: May or may not be included depending on the model/variant
Phone Attachment: Attached via clip/magnetic mounting mechanism on the back of the phone
Cooling Area: In the middle of the back of the phone, mainly to reduce heat in the processor/battery area
Fan: May produce some noise due to high-speed rotation
Condensation: Extreme cooling in humid environments may cause water/condensation formation
Main Purpose: Keeps phone temperature low during extended gaming sessions and helps reduce thermal throttling.